Fibocom attended Intel Ecosystem Symposium

July 31,2014, Intel Ecosystem Symposium was held in Sheraton Shenzhen Futian Hotel. Nearly 200 local partners of Intel and more than 1000 guests attended the conference.

As a strategic partner of Intel MCG M2M, Fibocom provides customers modules & solutions based on Intel baseband. Be invited to attend the summit, Fibocom displayed 3G/4G wireless communication modules. Ying Lingpeng, Fibocom General Manager, was interviewed by more than 20 media reporters on the scene.

In the summit, Fibocom WCDMA/HSPA+ H3 series module is acclaimed for its small dimensions and cost-effective product solutions. Based on Intel chip XMM626X platform, H3 series transfer speed is up to 21Mbps. To provide a rich application interfaces and also support Android/Win XP/Win8/Linux drive, H3 series allows customer to achieve the industrys high levels of sensitivity, flexibility and ease of integration.

Fibocom also displayed samples of LTE module at the summit and attracted strong attention from guests. L8xx series is a complete multi-band TDD-LTE/FDD-LTE/WCDMA/TD-SCDMA/GSM module, will be launch in the third quarter of 2014.

As a Chinese leading Machine-to-Machine communication and LBS solutions provider, Fibocom offer reliable products &technical solutions to satisfy the demand of mobile broadband applications. It is ideal for a wide range of products including tablet computers, wireless payments, digital signage, smart grid , Internet of things, medical industry and much more.