Fibocom Was Invited By INTEL LOEM SUMMIT 2015

Intel was proud to host the LOEM Summit 2015, the premier matchmaking event for his top partners, located at the Grand Hyatt in beautiful Shenzhen, China. As one of the most important strategic partners, Fibocom was invited to attend this summit.

Fibocom Sofia solution made its debut in LOEM summit. SC610 (Sofia 3GR), a smart communication solution developed by Fibocom, has been put into mass production. Cost-efficient and highly-integrated, the solution can significantly reduce development costs and shorten development periods. Fibocom will provide design recommendations for industry products so as to further lower the threshold for product development and ensure that customersí» products can be released to the market in the shortest time possible. During LOEM SUMMIT 2015, Fibocom had in-depth discussions on market trend, technology and product in IOT with Chinese and overseas top brands.



LOEM Summit brings together nearly two hundred ODMs (Original Design Manufacturers), Local OEMs, and System Integrators for 2½ days of scheduled matchmaking meetings, networking time and evening entertainment. Attendees also have access to Intel executives and product experts, who are on-site for networking and sharing information about Intel channel strategies, key technologies and market opportunities.


For more information of INTEL LOEM SUMMIT 2015, please click:

http://loemsummit.intel.com/index.php?c=d&l=cn